TEE, TONG Y.: search on Z-Library

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1

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 268 KB

english, 2003

2

Adaptive Neural Control for Output Feedback Nonlinear Systems Using a Barrier Lyapunov Function

Beibei Ren,, Shuzhi Sam Ge,, Keng Peng Tee,, Tong Heng Lee,

Journal:

IEEE Transactions on Neural Networks

Year:

2010

Language:

english

File:

PDF, 377 KB

english, 2010

3

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 283 KB

english, 2003

4

Dynamic responses and solder joint reliability under board level drop test

Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.15 MB

english, 2007

5

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA

Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 342 KB

english, 2006

6

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Tong Yan Tee, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 448 KB

english, 2004

7

Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages

Tong Yan Tee, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 528 KB

english, 2004

8

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Silver Glues and Lead-free Alloys in Die Attach of Power Devices

Gobbato, L., Scandurra, A., Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 2.68 MB

english, 2005

9

Prospective association of the Mediterranean diet with cardiovascular disease incidence and mortality and its population impact in a non-Mediterranean population: the EPIC-Norfolk study

Tong, Tammy Y. N., Wareham, Nicholas J., Khaw, Kay-Tee, Imamura, Fumiaki, Forouhi, Nita G.

Journal:

Year:

2016

Language:

english

File:

PDF, 671 KB

english, 2016

10

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill

Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 424 KB

english, 2003

11

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test

Tee, Tong Yan, Tan, Long Bin, Anderson, Rex, Ng, Hun Shen, Low, Jim Hee, Khoo, Choong Peng, Moody, Robert, Rogers, Boyd

Year:

2008

Language:

english

File:

PDF, 11.45 MB

english, 2008

12

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Study of PCB Strains and Component Position Under Board Level Drop Test

Fong Kuan Ng,, Chwee Teck Lim,, Pek, E., Jing-En Luan,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 5.40 MB

english, 2005

13

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Fine pitch Cu pillar wafer process development and seed layer etching characterization

Li Yan Siow,, Wei Deng,, Qing Xin Zhang,, Tai Chong Chai,, Chee Guan Koh,, Witarsa, D., Xianfeng Wang,, Hongqi Sun,, Ando, T., Tong Yan Tee,, Wong, J.

Year:

2012

Language:

english

File:

PDF, 1.29 MB

english, 2012

14

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Investigating the Cyclic Bending of PCB Subassembly During Board Level Drop Test

Pek, E., Chwee Teck Lim,, Tong Yan Tee,, Jing-en Luan,, Tan, V.B.C.

Year:

2005

Language:

english

File:

PDF, 4.93 MB

english, 2005

15

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Comparative electromigration performance of Pb Free flip chip joints with varying board surface condition

Nicholls, Lou, Darveaux, Robert, Syed, Ahmer, Loo, Shane, Tee, Tong Yan, Wassick, Thomas A., Batchelor, Bill

Year:

2009

Language:

english

File:

PDF, 927 KB

english, 2009

16

[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact

Tong Yan Tee,, Jing-en Luan,, Pek, E., Chwee Teck Lim,, Zhaowei Zhong,

Year:

2004

Language:

english

File:

PDF, 840 KB

english, 2004

17

Numerical and experimental correlation of high temperature reliability of gold wire bonding to intermetallics (Au/Al) uniformity

Xueren Zhang, Tong Yan Tee

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 577 KB

english, 2006

18

Advances in Wafer Level Packaging (WLP)

Tong Yan Tee, Xuejun Fan, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 102 KB

english, 2010

19

Advanced analysis on board trace reliability of WLCSP under drop impact

Ahmer Syed, Tong Yan Tee, Hun Shen Ng, Rex Anderson, Choong Peng Khoo, Boyd Rogers

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.63 MB

english, 2010

20

[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Design for standard impact pulses of drop tester using dynamic simulation

Hun Shen Ng,, Tong Yan Tee,, Jing-en Luan,

Year:

2004

Language:

english

File:

PDF, 462 KB

english, 2004

21

Impact life prediction modeling of TFBGA packages under board level drop test

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 487 KB

english, 2004

22

The institutionalization of Asian American literary studies in Taiwan: a diasporic Sinophone Malaysian perspective

Journal:

Inter-Asia Cultural Studies

Year:

2012

Language:

english

File:

PDF, 189 KB

english, 2012

23

The physical and chemical character of graphite

Tee, Peter A. H., Tonge, Brian L.

Journal:

Journal of Chemical Education

Year:

1963

Language:

english

File:

PDF, 7.66 MB

english, 1963

24

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Board level drop test and simulation of TFBGA packages for telecommunication applications

Tong Yan Tee,, Hun Shen Ng,, Chwee Teck Lim,, Pek, E., Zhaowei Zhong,

Year:

2003

Language:

english

File:

PDF, 811 KB

english, 2003

25

[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - Design analysis of solder joint reliability for stacked die mixed flip-chip and wirebond BGA

Tee Tong Yan,, Mayhuan Lim,, Ng Hun Shen,, Baraton, X., Kaire, D., Zhong Zhaowei,

Year:

2002

Language:

english

File:

PDF, 812 KB

english, 2002

26

The use of a pathway checklist to improve the management of osteoporosis in patients with hip fragility fractures

Teo, Shu-lin, Hien, Chia Tee, Kamun, Tong

Journal:

Osteoporosis and Sarcopenia

Year:

2017

Language:

english

File:

PDF, 367 KB

english, 2017

27

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Effects of Thermal, Moisture and Mechanical Loading Conditions on Interfacial Fracture Toughness using Brazil-nut Specimens

Loo, S., Mhaisalkar, S., Xueren Zhang,, Hun Shen Ng,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 3.81 MB

english, 2005

28

[IEEE International Symposium on Electronic Materials and Packaging (EMAP2000) - Hong Kong, China (30 Nov.-2 Dec. 2000)] International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) - Board level solder joint reliability modeling of LFBGA package

Tong Yan Tee,, Sivakumar, K., Do-Bento-Vieira, A.

Year:

2000

Language:

english

File:

PDF, 402 KB

english, 2000

29

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

Xueren Zhang,, Tong Yan Tee,, Jing-en Luan,

Year:

2005

Language:

english

File:

PDF, 505 KB

english, 2005

30

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Absolute and relative fatigue life prediction methodology for virtual qualification and design enhancement of lead-free BGA

Hun Shen Ng,, Tong Yan Tee,, Kim Yong Goh,, Jing-en Luan,, Reinikainen, T., Hussa, E., Kujala, A.

Year:

2005

Language:

english

File:

PDF, 686 KB

english, 2005

31

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique

De Lim, Fabian Zhi, Tan, Long Bin, Quan, Chenggen, Tee, Tong Yan

Year:

2009

Language:

english

File:

PDF, 635 KB

english, 2009

32

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Drop Impact Life Prediction Model for Wafer Level Chip Scale Packages

Kim Yong Goh,, Jing-en Luan,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 4.41 MB

english, 2005

33

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Analysis of PCB subassembly dynamic responses using integrated analytical, numerical and experimental techniques

Jing-en Luan,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 634 KB

english, 2005

34

[IEEE 2012 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) - Graz, Austria (2012.05.13-2012.05.16)] 2012 IEEE International Instrumentation and Measurement Technology Conference Proceedings - Periodic piecewise linear excitation for ADC testing

Ong, Tat Chern, Tee, Min Tong, Kuang, Ye Chow, Ooi, Melanie Po-Leen, Demidenko, Serge

Year:

2012

Language:

english

File:

PDF, 1.45 MB

english, 2012

35

Errata

Jing-en Luan,, Tong Yan Tee,

Journal:

IEEE Electron Device Letters

Year:

1982

Language:

english

File:

PDF, 80 KB

english, 1982

36

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Development of low-cost wafer level package through integrated design and simulation analysis

Tee, Tong Yan, Siew, Glen, Chen, Haoyang, Soh, Serine, Kang, In Soo, Kim, Jong Heon, Lee, Teck Kheng, Ser, Bok Leng, Ng, Hun Shen, Hoe, Germaine, Gao, Shan

Year:

2011

Language:

english

File:

PDF, 4.55 MB

english, 2011

37

DESIGN FOR BOARD LEVEL RELIABILITY OF A MINIATURIZED MEMS PACKAGE: STACKED DIE TQFN

TEE, TONG Y., FREZZA, GIOVANNI, LIM, MAYHUAN, NG, HUN S., ZIGLIOLI, FEDERICO, ZHONG, ZHAOWEI

Journal:

International Journal of Computational Engineering Science

Year:

2003

Language:

english

File:

PDF, 311 KB

english, 2003

38

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Rate-dependent properties of Sn-Ag-Cu based lead free solder joints

Su, Yong'An, Tan, Long Bin, Tan, Vincent B.C., Tee, Tong Yan

Year:

2009

Language:

english

File:

PDF, 1.09 MB

english, 2009

39

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - SMT process robustness and board level solder joint reliability of C/sup 2/BGA

Tiao Zhou,, Villa, C.M., Tong Yan Tee,, Haibin Du,

Year:

2003

Language:

english

File:

PDF, 397 KB

english, 2003

40

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Prototyping of low-cost wafer level packages

Chen, Haoyang, Tee, Tong Yan, Siew, Glen, Soh, Serine, Kang, In Soo, Kim, Jong Heon, Lee, Teck Kheng, Ser, Bok Leng, Ng, Hun Shen, Hoe, Germaine, Gao, Shan

Year:

2011

Language:

english

File:

PDF, 1.72 MB

english, 2011

41

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Effect of unfilled underfill on drop test and thermal cycle reliability

Ibe, E.S., Loh, K.I., Jing-en Luan,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 635 KB

english, 2005

42

Evolutionary Genetics of Human Enterovirus 71: Origin, Population Dynamics, Natural Selection, and Seasonal Periodicity of the VP1 Gene

Tee, K. K., Lam, T. T.-Y., Chan, Y. F., Bible, J. M., Kamarulzaman, A., Tong, C. Y. W., Takebe, Y., Pybus, O. G.

Journal:

Journal of Virology

Year:

2010

Language:

english

File:

PDF, 398 KB

english, 2010

43

Impact of Thermal, Moisture, and Mechanical Loading Conditions on Interfacial Fracture Toughness of Adhesively Bonded Joints

Shane Loo, Xueren Zhang, Hun Shen Ng, Tong Yan Tee, S. G. Mhaisalkar

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 454 KB

english, 2007

44

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Effect of ground plane design for WLP with signal integrity modeling and analysis

Siew, Glen, Yan, Tee Tong, Haoyang, Chen, Soh, Serine, Heon, Kim Jong

Year:

2010

File:

PDF, 631 KB

2010

45

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Drop impact life prediction model for lead-free BGA packages and modules

Jing-en Luan,, Tong Yan Tee,, Kim Yong Goh,, Hun Shen Ng,, Baraton, X., Brenner, R., Sorricul, M.

Year:

2005

Language:

english

File:

PDF, 1.34 MB

english, 2005

46

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Effect of impact pulse parameters on consistency of board level drop test and dynamic responses

Jing-en Luan,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 641 KB

english, 2005

47

Respiratory virus infection after allogeneic hematopoietic stem cell transplant in a tropical center: Predictive value of the immunodeficiency scoring index

Wang, Lin, Allen, John, Diong, Colin, Goh, Yeow-Tee, Gopalakrishnan, Sathish, Ho, Aloysius, Hwang, William, Lim, Francesca, Oon, Lynette, Tan, Thuan-Tong, Linn, Yeh-Ching, Tan, Ban Hock

Journal:

Transplant Infectious Disease

Year:

2017

Language:

english

File:

PDF, 1.03 MB

english, 2017

48

Challenges for Quality Assurance of Target Volume Delineation in Clinical Trials

Chang, Amy Tien Yee, Tan, Li Tee, Duke, Simon, Ng, Wai-Tong

Journal:

Frontiers in Oncology

Year:

2017

Language:

english

File:

PDF, 182 KB

english, 2017

49

Primer and probe conservation issue in the quantification of hepatitis B virus DNA

Teh, Chye Phing, Chook, Jack Bee, Ngeow, Yun Fong, Tong, Tommy Yuh Koon, Tee, Kok Keng, Bong, Jan Jin, Mohamed, Rosmawati

Journal:

Reviews in Medical Virology

Year:

2020

File:

PDF, 596 KB

2020

50

Effects of One Night of Sleep Deprivation on Hormone Profiles and Performance Efficiency

Goh, Victor Hng-Hang, Tong, Tarry Yoke-Yin, Lim, Chin-Leong, Low, Edwin Cheng-Tee, Lee, Lionel Kim-Hock

Journal:

Military Medicine

Year:

2001

Language:

english

File:

PDF, 908 KB

english, 2001

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